There was mixed news to start the week from Nvidia’s key supplier Taiwan Semiconductor Manufacturing, or TSMC.

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD (AMD). However, it has a high production cost. It also uses a ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

In addition, Taiwan media reported that Nvidia was cutting CoWoS-S orders from TSMC in a potential hit to the Taiwanese chip foundry's revenue. Nvidia has been selling its Blackwell chips as ...

Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

TSMC management has indicated enormous AI opportunity for its foundry business, particularly for GPUs and ASICs. See why I ...

There was mixed news to start the week from Nvidia’s key supplier Taiwan Semiconductor Manufacturing, or TSMC.